la187b-5/4g1h-pf doc. no : qw0905-la187b-5/4g1h-pf rev. : a date : 20 - sep. - 2006 data sheet ligitek electronics co.,ltd. property of ligitek only led array lead-free parts pb
ligitek electronics co.,ltd. property of ligitek only 41.0 9.0x4=36.0 part no. la187b-5/4g1h-pf package dimensions note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 5.1 lg2640-1-pf 2.54typ 0.5 typ - + 2.9 3.1 + - 25.0min 1.0min 2.54typ 0.5 typ 4.3 3.3 1.5max 7.4 5.05 0.5 lg 2.9 0.3 + 6.35 page 1/6 lh2640-1-pf g g gg h 1.6 +0 -0.5 ? 3.25 2.9
page ligitek electronics co.,ltd. property of ligitek only unit ma ma mw a viewing angle 2 1/2 (deg) 4.2 1.8 90 697 red diffused red gap2.6 1.7 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. green diffused tstg lens typical electrical & optical characteristics (ta=25 ) gap material la187b-5/4g1h-pf part no emitted green color power dissipation operating temperature reverse current @5v storage temperature t opr ir pd 565 peak wave length pnm 30 spectral halfwidth nm min. luminous intensity @10ma(mcd) min.max. 1.72.6 forward voltage @ ma(v) 20 typ. 1220 10 -40 ~ +85 -40 ~ +100 10040 symbol absolute maximum ratings at ta=25 forward current parameter peak forward current duty 1/10@10khz i f i fp ratings 120 30 g 60 15 h 50 50 2/6 part no. la187b-5/4g1h-pf
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) page forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip fig.6 directive radiation 3/6 part no. la187b-5/4g1h-pf
4/6 ligitek electronics co.,ltd. property of ligitek only forward current(ma) forward voltage(v) fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) 600 wavelength (nm) 1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a 500 0.0 0.5 0.9 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 -40 0.8 -20 1.0 1.1 1.2 700800900 3.0 2.0 1.0 1.5 2.5 fig.4 relative intensity vs. temperature 0.0 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 80 40 20 060100 ambient temperature( ) -40-20 020406080100 2.0 typical electro-optical characteristics curve fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) 1.0 1.0 0.1 10 100 h chip 1000 3.0 fig.2 relative intensity vs. forward current 2.5 2.0 0.5 1.0 1.5 0.0 3.04.0 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 5.01.0101001000 page part no. la187b-5/4g1h-pf
ligitek electronics co.,ltd. property of ligitek only 260 c3sec max 5 /sec max 120 seconds max preheat 25 0 0 120 2 /sec max 100 260 temp( c) 200 time(sec) 250 soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to case) dip soldering preheat: 120 c max preheat time: 120seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) 2.wave soldering profile page 5/6 note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. part no. la187b-5/4g1h-pf
ligitek electronics co.,ltd. property of ligitek only the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.t.sol=230 5 2.dwell time=5 1sec solderability test high temperature storage test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) high temperature high humidity test thermal shock test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test operating life test reliability test: test condition 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) test item description mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 reference standard page 6/6 part no. la187b-5/4g1h-pf
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